Dimensity 9300 faster than Snapdragon 8 Gen 3

Mediatek is expected to soon launch the Dimensity 9300 chipset. According to previous reports by Digital Chat Station, the chipset will feature four Cortex-X4 cores and four Cortex-A720 units, with no low-power A520 cores. Today, the same source provided further information about the CPU clock speeds, claiming that the Dimensity 9300 will be 10% faster than the Qualcomm Snapdragon 8 Gen 3.

Mediatek is expected to adopt a 1+3+4 architecture, featuring 1x3.25 GHz Cortex-X4, 3x2.85 GHz Cortex-X4, and 4x2.0 GHz Cortex-A720. Additionally, an Immortalis-G720 GPU is expected to be included. This is in contrast to the Snapdragon's 1+5+2 setup, which includes 1x3.19 GHz Cortex-X4, 5x2.96 GHz Cortex-A720, and 2x2.27 GHz Cortex-A520.

While the combination of the Snapdragon 8 Gen 3 is fairly unorthodox, Mediatek is trying something unseen before by omitting the low-power cores. It remains to be seen how this will perform in real-life scenarios and whether manufacturers will be able to avoid overheating issues and extract the chip's otherwise huge potential.
 
Snapdragon 8 Gen 3
Snapdragon 8 Gen 3. Source GSM Arena

Mediatek is expected to soon launch the Dimensity 9300 chipset. According to previous reports by Digital Chat Station, the chipset will feature four Cortex-X4 cores and four Cortex-A720 units, with no low-power A520 cores. Today, the same source provided further information about the CPU clock speeds, claiming that the Dimensity 9300 will be 10% faster than the Qualcomm Snapdragon 8 Gen 3.

Mediatek is expected to adopt a 1+3+4 architecture, featuring 1x3.25 GHz Cortex-X4, 3x2.85 GHz Cortex-X4, and 4x2.0 GHz Cortex-A720. Additionally, an Immortalis-G720 GPU is expected to be included. This is in contrast to the Snapdragon's 1+5+2 setup, which includes 1x3.19 GHz Cortex-X4, 5x2.96 GHz Cortex-A720, and 2x2.27 GHz Cortex-A520.

While the combination of the Snapdragon 8 Gen 3 is fairly unorthodox, Mediatek is trying something unseen before by omitting the low-power cores. It remains to be seen how this will perform in real-life scenarios and whether manufacturers will be able to avoid overheating issues and extract the chip's otherwise huge potential.

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